How to detect internal defects of IGBT module with X-Ray detection equipment
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Author:hecq88
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Published time: 2018-10-31
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The IGBT module is a low frequency, high power electronic component that is packaged by IGBT (Insulated Gate Bipolar Transistor Chip) and FWD (Freewheeling Diode Chip) through a specific circuit bridge. The packaged IGBT module is directly It is mainly used in welding machines, inverters, inverters, electroplating electrolysis power supplies, super-audio induction heating, USB uninterruptible power supplies and other fields.
The IGBT module is a low-frequency, high-power electronic component that is packaged by IGBT (Insulated Gate Bipolar Transistor Chip) and FWD (Freewheeling Diode Chip) through a specific circuit bridge. The packaged IGBT module is directly It is mainly used in welding machines, inverters, inverters, electroplating electrolysis power supplies, super-audio induction heating, USB uninterruptible power supplies and other fields.
IGBT module has the advantages of energy saving and stability, and is the core device of energy conversion and transmission. Therefore, it is also called the CPU of electronic device in the market. Especially when the current environmental protection concept is prevalent, it is more and more recognized by the market, and more National strategic emerging industry layouts, such as rail transit, smart grid, aerospace and new energy.
How to realize the detection of IGBT modules in the packaging process and block the defective IGBT modules into the subsequent process, thereby reducing the production cost, improving the quality of the products, and avoiding the use of defective IGBT modules, causing significant losses, which has become an urgent problem in the industry.
The X-Ray inspection equipment uses the X-ray transmission principle to detect the IGBT module without additional cost, and the detection is fast and accurate. When the X-Ray detection device transmits the IGBT module, it is possible to directly observe the presence or absence of a defect such as a bubble inside the IGBT module, and directly observe the position of the defect.
