Application of X-ray inspection equipment in PCB assembly
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Author:hecq88
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Published time: 2018-10-31
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In the electronics manufacturing industry, printed circuit board (PCB) components are getting smaller and smaller, and assembly density is becoming higher and higher, which has become a continuous development trend. This trend is not necessarily due to the fact that PCB components are getting smaller, but because the new design significantly uses more ball-gear array packages (BGAs) and other devices that hide solder connections, such as quad flat no-lead packages. (QFN) and Grid Array Package (LGA). These devices typically have advantages in terms of performance and cost compared to larger leaded packages, so the trend toward smaller and denser values may continue.
In the electronics manufacturing industry, printed circuit board (PCB) components are getting smaller and smaller, and assembly density is becoming higher and higher, which has become a continuous development trend. This trend is not necessarily due to the fact that PCB components are getting smaller, but because the new design significantly uses more ball-gear array packages (BGAs) and other devices that hide solder connections, such as quad flat no-lead packages. (QFN) and Grid Array Package (LGA). These devices typically have advantages in terms of performance and cost compared to larger leaded packages, so the trend toward smaller and denser values may continue.
Automated Optical Inspection (AOI) is a proven, proven, and critical process control technology in the SMT industry that greatly enhances confidence in the quality of finished products during PCB assembly production. However, how do you detect the solder joints that are invisible to the naked eye for the inside of the PCB assembly? The X-ray inspection equipment is exactly the answer.
Since the "hidden connection point" device is misplaced, the manufactured PCB assembly cannot be repaired or requires high maintenance costs, and the use of X-ray inspection equipment as a process control method can eliminate this risk. Mis-mounting devices are not only time consuming, but can also cause other problems on the PCB assembly. Rework can also exceed the maximum number of reflow cycles that a double-sided component can withstand, causing failures in the later stages of the process, resulting in additional repair time and Repair fees.
So when should I use X-ray inspection equipment? Of course, it is used during the “first time” inspection process. It is sensible to randomly select several samples for X-ray internalization in the initial, middle and end stages of a batch start production during the production and assembly of PCB components. After testing, it can be found whether there is a quality defect inside the PCB component produced.
