The IC industry is developing rapidly, and X-ray inspection equipment will play an important role.
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Author:hecq88
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Published time: 2018-10-31
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It is reported that in 2017, the global IC industry revenue exceeded $400 billion. The latest forecasts from major research institutions show that this year will achieve about 15% growth, and in 2019 it is expected to exceed $500 billion. In the long run, the outlook for the integrated circuit industry is clear. With the demand for diversified and diverse intelligent applications such as big data, new storage, automotive electronics, artificial intelligence, 5G, etc., China's integrated circuit capacity is accelerating. This will bring a once-in-a-lifetime opportunity for the IC packaging and inspection equipment market.
It is reported that in 2017, the global IC industry revenue exceeded $400 billion. The latest forecasts from major research institutions show that this year will achieve about 15% growth, and in 2019 it is expected to exceed $500 billion. In the long run, the outlook for the integrated circuit industry is clear. With the demand for diversified and diverse intelligent applications such as big data, new storage, automotive electronics, artificial intelligence, 5G, etc., China's integrated circuit capacity is accelerating. This will bring a once-in-a-lifetime opportunity for the IC packaging and inspection equipment market.
At present, most of the electronic components commonly used in integrated circuits are sealed with epoxy resin or other glues and alloys. Due to the compact and complicated internal structure of electronic products and the miniaturized shape, ordinary testing instruments cannot detect internal defects. The ray inspection equipment has played its special skills.
When the X-ray inspection device transmits electronic components, the defects (such as breaks, voids, etc.) in the electronic components and the defect-free portions have different X-ray absorption capacities due to the different distribution densities of the solder metal. The ray passing through the defective portion is higher than the ray intensity at the non-defective portion, and therefore it is possible to judge whether or not there is a defect in the electronic component by detecting the difference in the ray intensity of the penetrating object.
